Effect of Protective Colloid on Properties of Poly(methylmethacrylate) Heat-sensitive Microcapsule

doi:10.3969/j.issn.1000-1565.2009.03.017

Journal of Hebei University (Natural Science Edition) ›› 2009, Vol. 29 ›› Issue (3): 295-300.DOI: 10.3969/j.issn.1000-1565.2009.03.017

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Effect of Protective Colloid on Properties of Poly(methylmethacrylate) Heat-sensitive Microcapsule

AN Pu-ying,LU Shuang

Online:2009-05-25 Published:2009-05-25

Abstract

CLC Number:

TQ316.3

AN Pu-ying,LU Shuang. Effect of Protective Colloid on Properties of Poly(methylmethacrylate) Heat-sensitive Microcapsule[J]. Journal of Hebei University (Natural Science Edition), 2009, 29(3): 295-300.

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[3]	LU Shuang,AN Pu-ying,BA Xin-wu. Study on Preparation and Property of P(MMA-CO-BA) Heat-sensitive Microcapsules [J]. Journal of Hebei University (Natural Science Edition), 2009, 29(6): 601-604,617.

Effect of Protective Colloid on Properties of Poly(methylmethacrylate) Heat-sensitive Microcapsule

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